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Autor/inn/en | Ng, Oi-Lam; Ye, Huiyan |
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Titel | Mathematics Learning as Embodied Making: Primary Students' Investigation of 3D Geometry with Handheld 3D Printing Technology |
Quelle | In: Asia Pacific Education Review, 23 (2022) 2, S.311-323 (13 Seiten)Infoseite zur Zeitschrift
PDF als Volltext |
Zusatzinformation | ORCID (Ng, Oi-Lam) |
Sprache | englisch |
Dokumenttyp | gedruckt; online; Zeitschriftenaufsatz |
ISSN | 1598-1037 |
DOI | 10.1007/s12564-022-09755-8 |
Schlagwörter | Elementary School Students; Elementary School Mathematics; Geometric Concepts; Computer Peripherals; Printing; Handheld Devices; Technology Uses in Education; Technology Integration; Foreign Countries; Mathematics Activities; Nonverbal Communication; Hong Kong |
Abstract | This paper reports on a mixed-methods, design-based study conducted with five classes of Primary 6 (age 11-12 years) students learning the properties of 3D solids. The researcher and participating teachers designed mathematics lessons that integrated the hands-on construction of artifacts (i.e., making) with a class set of 3D printing pens to introduce various properties of prisms and pyramids in two primary schools in Hong Kong. Quantitative results show that the designed learning activities with 3D printing technology greatly supported student learning on all questions related to working with vertices (0D), edges (1D), and faces (2D). Qualitatively, one researcher observed that the students produced hand movements and language that were conducive to learning the properties of 3D solids while they interacted with 3D printing pens. This study draws attention to the unity of mind-body and body-tool interactions in the act of making something (i.e., mathematics learning as embodied making). (As Provided). |
Anmerkungen | Springer. Available from: Springer Nature. One New York Plaza, Suite 4600, New York, NY 10004. Tel: 800-777-4643; Tel: 212-460-1500; Fax: 212-460-1700; e-mail: customerservice@springernature.com; Web site: https://link.springer.com/ |
Erfasst von | ERIC (Education Resources Information Center), Washington, DC |
Update | 2024/1/01 |